Senior Staff Packaging Engineer

Package Engineering San Jose, California

Job Description

Responsible for defining substrate/package design rules, process flow and material set for new automotive power module packages
Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
Develop new assembly technologies, run process DOE’s, to define process windows for new package development
Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group
Work closely with offshore assembly and substrate partners to develop new processes
Work closely with IC design teams to define package design rules and define packages to meet their requirements
Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products

Job Requirements

BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.
Minimum experience 12 years in semiconductor packaging technology.
Experience leaded multi-die packages.
Understanding of organic laminate technologies manufacturing and supplier capabilities.
Experience in SMT or passive integrated package assembly is a plus.
Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
Experience with package substrate design rules, tools (including AutoCAD).
Knowledge of AEQ Automotive reliability requirements.
Knowledge of APQP automotive development process
Knowledge of JEDEC/IPC design standards.
Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus.
Travel to Asia to attend technology reviews and resolve subcon/supplier issues

Pay: Up to $195K, commensurate with experience.