Staff Packaging Engineer
Description
Job Description
- Responsible for defining package design rules, process flow and material set for new products including automotive power module packages
- Drive alignment between module design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
- Develop new assembly technologies, run process DOE’s, to define process windows for new package development
- Define and Drive reliability testing and qualification of new module packages in conjunction with the reliability group
- Work closely with offshore assembly and substrate partners to develop new processes
- Work closely with New Product Definition teams to define packages to meet their requirements
- Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products
- Transfer knowledge developed in the NPI process to the sustaining team to ensure a smooth transition to production
Job Requirements
- BS Degree in Electrical Engineering, Mechanical Engineering, Material Science
- 8 years of experience in semiconductor packaging technology
- Experience in leaded multi-die packages
- Understanding of organic laminate technologies manufacturing and supplier capabilities.
- Experience in SMT or passive integrated package assembly is a plus.
- Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation (Flip Chip is a plus)
- Experience with package substrate design rules, tools (including AutoCAD)
- Knowledge of AEQ Automotive reliability requirements
- Knowledge of APQP automotive development process
- Knowledge of JEDEC/IPC design standards
- Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus
- Ability to work in a fast-paced, high stress environment with high rates of change
- Able to work with people in the US timezone