Staff System-On-Chip Modeling Engineer

CTO OFFICE Santa Clara, California


Description

  • Model new image sensor technology System-on-Chip solutions using Python/SystemC/VerilogA. Responsible for model development of analog and mixed-signal pixel circuitry and readout circuitry in order to enable efficient system emulation suitable to generate e.g. training data for early algorithm development.
  • Conduct design verification and modeling using SVA, Python, Perl, C++ and HLS.
  • Validate and match system level models against circuit simulations and real world performance and draw conclusions.
  • Engage closely with cross-functional teams to establish and validate important system parameters and their trade-offs.
  • Work with sensor digital and analog engineers for system design, integration and validation.
  • Work with algorithm engineers for module level design.
  • Work with algorithm and application engineers for image tuning and qualification.
  • Define system specifications and analyze failure modes.
  • Identify potential solutions to overcome circuit/device limitations at early R&D stage.
  • Assist in product planning by careful balance of schedule, resources and key specifications.
  • Conduct silicon validation, debugging and tuning.
 
Requirements:
 
Master’s degree in Electrical Engineering, Computer Engineering, Applied Physics or related fields plus three (3) years of experience in CMOS image sensors related engineering occupations.
 
Required experience:
  • Experience in a device (solid-state physics) for transistors and memory (SRAM, DRAM, Emerging memories).
  • Experience in CMOS image sensors, camera systems, image signal processing, and/or digital signal processing or related fields.
  • Experience in using Cadence/Virtuoso in the context of SPICE/Spectre circuit simulations.
  • Experience in Python Experience in VerilogA.
  • Familiarity with C/C++ in an object-oriented context.
  • Experience in optical simulation.
  • Mechanical simulation for packages.
  • Experience in hands-on device characterization and analysis.
  • Experience with AI-related accelerators, display technology, and MEMS sensor technology.
  • Working experience with process integration engineers for module-level design.
  • Working experience closely with a digital architecture engineer for the module-level design of a neural processing unit.
  • Project management experience to collaborate with external partners.
 
Annual base salary for this role in California, US is expected to be between $178,006 - $180,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.