2021 Internship - Application Engineering

Software Engineering Shenzhen, China


Description

Responsibilities:

  • Collaborate with local and world-wide development team(s) to debug problems.
  • Write technical collateral, including knowledge base articles, quick start guides and code examples.
  • Embedded software programming using C / C++
  • Strong knowledge of electrical or computer engineering fundamentals and methodologies
  • Collaborate with local and world-wide development team(s) to debug problems.
  • Troubleshoot and debug electronic systems, circuits, and devices.

Qualifications:

  • Experience in projects on developing firmware for 32-bit ARM Cortex MCUs and/or wireless communication protocols is a plus
  • Take part in college competitions in electronic designs, data modelling, etc. is a plus
  • Experience in using electronics laboratory equipment and measurement techniques
  • Able to read / write / speak in English 

Experience and Education:

  • Currently pursuing a bachelor’s Degree or Master’s Degree in Engineering
  • 3 – 6 months internship availability

 工作内容

  • 物联网产品的嵌入式软件研发工作和模块测试,编写相关技术文档
  • 熟悉嵌入式系统C/C++语言编程
  • 熟悉嵌入式软件开发流程
  • 嵌入式操作系统的裁剪和移植,驱动的开发,系统的集成和测试
  • 配合同事完成系统软件及驱动其他模块的开发项目
  • 较强的英文阅读能力,能熟练的阅读技术文档
  • 在校期间有过单片机/ARM/DSP/FPGA相关经验的优先
  • 在校期间参加过电子设计大赛,数模竞赛或具备动手实践项目,的优先,获得过奖项的尤佳
  • 良好的团队协作精神,有上进心,学习能力强,工作效率高,良好的交流沟通和团队协作能力
  • 大学本科以上学历,电子、计算机,自动化控制,仪器仪表等相关专业相关专业优先
  • 3-6月的实习时间

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.