Engineering Manager - RF Interconnects

Engineering New Albany, Indiana Anywhere, USA

Descripción

Puesto en Samtec, Inc

Founded in 1976, Samtec is a privately held, $1 Billion global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service. 
** THIS POSITION WILL BE ONSITE AT SAMTEC - NEW ALBANY, IN ** 
Summary/Objective:  The Engineering Manager for RF Interconnects leads a team that conceptualizes, designs and develops RF/Microwave interconnect products.
Essential Functions/ Responsibilities: 
  1. Reviews and rationalize new product scopes. 
  2. Reviews and critiques design architectures. 
  3. Actively participates and supports peer design reviews and other team efforts. 
  4. Reviews and approves document change requests. 
  5. Reviews and addresses specification deviations as required. 
  6. Identifies technology gaps and sponsors projects to close those. 
  7. Recruits, mentors and develops other members of the team. 
  8. Handles multiple projects simultaneously as priorities can change very quickly. 
  9. Works and communicates regularly with Marketing, Quality and Operations. 
  10. Delegates projects and oversees their progress, engaging when required. 
  11. Supports Project Management team with regular updates to the tracking system. (PTS) 
  12. Establishes and manages team metrics. 
“The responsibilities as defined are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities” 
Required Experience: 
  1. 7+ Years’ of Experience in RF Interconnect Design. 
  2. Hands-on experience troubleshooting and debugging mmWave (40+ GHz) interconnect products.
  3. Proficient in the interpretation of s-parameter and Time Domain Reflectometry (TDR) measurements.
  4. Strong mechanical aptitude with experience in blueprint reading, GD&T and tolerance stack-ups.
  5. Experience leading and supervising Engineers. 
  6. Knowledge of electromagnetic simulation techniques and/or network analyzer operation is desired.
  7. Process capability knowledge, as it pertains to precision machining is desired.
  8. Ability to use SolidWorks and MS Office Suite, MS Project, SharePoint Document Management and general computer literacy.
  9. Solid interpersonal communication skills, a professional demeanor, cooperative personality and a team attitude are all required.  Works well with others and interacts effectively and efficiently with internal and external people and groups. 
  10. Strong verbal and written communication skills.
  11. Extensive cross-functional team expertise including technical and non-technical work.
  12. Analytical and creative thinker, problem solver, result-orientated and focused.
  13. Motivated, high achiever, persistent and conscientious. 
Education:  
  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering or equivalent is required. 
  • Master’s degree in Engineering or Management. 

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