Samtec, Inc 职业

描述

Founded in 1976, Samtec is a privately held, $950 million global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service.

Samtec is seeking a Director of Optoelectronics Engineering for the Colorado Springs, CO location. The salary range for this position is $160,000 - $260,000 per year inclusive of applicable bonus and commensurate with experience. Standard benefit offerings available are medical (HSA/PPO), dental, vision, group life, AD&D, short and long term disability, EAP, 401k plus other voluntary options as well as time off.   We anticipate this position to close on 6/10/2024. Please submit your application at your earliest convenience to be considered.

Summary/Objective:  The Engineering Director owns the development of optoelectronics and electronic packaging products, processes, test, and NPI engineering.  At the core of the optoelectronics assemblies are "optical engines" consisting of optics, electronics, and optoelectronic devices.  The Engineering Director will have extensive experience in microelectronics, optoelectronics, flip chip, wire bonding, die attach, thermal bonding of wafers, and semiconductor processing of logic ICs and optoelectronics ICs such as lasers, detectors, and physical layer ASICSs.  The Engineering Director will have a background in semiconductor fabrication processes and optical engine technology will be a significant advantage.  As one of the most senior people on location, you are also responsible to provide leadership to groups under your influence, even if not your management.  

Essential Functions/Responsibilities:  

1. Engineering Leader:
   • Manage, lead, and inspire engineering team to execute portfolio of development, sustaining, and support programs on time, on quality, on cost, and on scope.
   • Elevate performance of engineering staff through modeling, mentoring, provocation, and accountability.
   • Hire world-class engineers and managers while ensuring efficient onboarding processes.
   • Organize people and instill collaboration through high-performance teams.
   • Implement and optimize development processes, with a focus on integrity, efficiency, and quality.
2. Process Development and Engineering:
   • Leverage in-depth knowledge of microelectronics processes, including flip chip, wire bonding, die attach, and thermal bonding of wafers and contribute technical knowledge to engineering teams
   • Oversee and guide the team in the development of complex microelectronics and ideally optoelectronics processes
3. Packaging Integration:
   • Collaborate with cross-functional teams to integrate optical components seamlessly into microelectronics packaging assemblies.
   • Contribute DfM and DfT features to new package designs
4. Semiconductor Operations Management:
   • Utilize semiconductor processing experience to improve operations, increasing throughput, improving yields and ensuring high quality assemblies
   • Key contributor to strategic planning for packaging and semiconductor-related projects.
5. Site Oversight:
   • Mentor site leadership team to excel in all site functions, some with solid line relations and others with dotted line responsibilities.

Requirements:  

1. 15+ years' experience in optoelectronics and semiconductor high volume manufacturing environment with 7+ years managing engineers and managers with demonstrated successive advancements and measurable accomplishments
2. Proven experience in microelectronics packaging design and processes, including flip chip, wire bonding, die attach, and thermal bonding of wafers.
3. Prefer expertise in optoelectronics processing.
4. Prior experience in semiconductor processing and semiconductor operations management.
5. Strong leadership skills with a demonstrated ability to lead and inspire teams.
6. Track record for developing and introducing products and processes to revenue operations and market acceptance.
7. Excellent problem-solving and decision-making abilities.
8. Exceptional communication and interpersonal skills.

Education: 

1. Bachelors Degree in Engineering with a preference for Electrical Engineering, Physics, Chemical Engineering, or Mechanical Engineering, and further preference for an advanced degree.