Senior Packaging Engineer

Package Engineering Ipoh, Malaysia

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Description

Job Description 
We’re hiring a hands-on Resident Package Engineer at a key OSAT partner to support mass production of multi-die wirebond leadframe packages. You will focus on sustaining manufacturing performance, supplier process control, and robust release-to-manufacturing (RTM) protocols to ensure product quality, yield and on-time delivery. 
Key responsibilities 
  • Act as the on-site technical owner at the OSAT for all packaging activity; act as primary engineering interface between OSAT operations and our packaging / product teams.
  • Support and troubleshoot day-to-day production issues (quality holds, yield excursions) and lead root-cause analysis and permanent corrective actions (8-D, RCA).
  • Implement and maintain RTM artifacts including process flows, control plans, work instructions, and SOPs.
  • Drive process control and SPC: define control charts, sample plans, capability studies (Cp/Cpk) and guardbanding for critical steps (die attach, wirebond, mold, trim/form, plating).
  • Oversee supplier change control and PCNs (Process Change Notices), BOM/process releases and supplier qualification runs.
  • Participate in supplier audits and periodic process/quality audits at the OSAT; capture and escalate nonconformances.
  • Run process characterization and DOE to improve yield, quality, capacity, and cycle time; document outcomes and update process specs.
  • Coordinate failure analysis and disposition of discrepant material (with material review board support).
  • Work with NPI and sustaining teams to transfer new or revised processes into consistent mass production practices.
  • Report KPIs weekly  (yield, DPPM, escape rate, cycle time, open corrective actions).
Required qualifications 
  • B.S. in Electrical, Mechanical, Materials, Chemical engineering or related discipline. 
  • Minimum 2 years’ experience in semiconductor back-end assembly — volume production experience required. 
  • Strong practical knowledge of wirebond processes, leadframe design considerations, clip bonding, plating and molding/encapsulation. 
  • Strong problem solving using 8-D, FMEA, DOE, SPC 
  • Experience with QC/FA tools (cross-section, decap, SEM, X-ray) and reading FA reports. 
  • Excellent communication skills — able to write process specs  
  • Willingness to be based full-time at the OSAT site with occasional travel to Malaysian operations hub in Penang. 
Additional preferred qualifications 
  • Direct experience producing power packages or automotive qualification work. 
  • Knowledge of AEQ Automotive reliability requirements 
  • Knowledge of APQP automotive development process 
  • Knowledge of JEDEC/IPC standards 
  • Ability to work in a fast-paced environment 
  • Able to occasionally work with colleagues in the US timezone 

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