IC Package Design Engineer WX-4992

Manufacturing and Quality Engineering Austin, Texas

At Cirrus Logic mixed-signal engineering drives our company. Innovation isn't just encouraged, its expected! If you are looking for a significantly impactful role in a fast paced environment, look no further! As an IC Package Design Engineer, you will have a direct impact on business working with both internal and external customers and designing innovative packages. Our products include top of the line Amps, Codecs and DSPs to name a few. Package types include WLCSP, Wirebond, and Flip-chip. This is your chance to be part of a results oriented package design team supporting innovative customer solutions in a dynamic environment.

Position Responsibilities

  • Work tightly with Global Design (UK and US) I.C. and board teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements
  • Collaborate with cross functional teams such as Design and Layout to define package requirements from electrical, thermal, and mechanical point of view
  • Utilize AutoCAD, GDS tools and Cadence SiP Layout tool to complete physical design and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
  • Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
  • Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
  • Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
  • Grow and promote automation processes throughout the package design flow
  • Develop test vehicles that accurately assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
  • Close collaboration with customers to resolve various design issues between the piece part and PCB

Required Skills and Qualifications

  • Bachelors or Masters in Mechanical or Electrical Engineering with 3-4 years of proven experience in design for manufacturability
  • Knowledge of packaging technologies, materials, package substrate design and assembly rules
  • Proficient with Cadence schematic (SiP), simulation and layout tools
  • Strong AutoCAD user
  • Understanding of electrical simulation results on a package design
  • Familiarity or ability to learn Cadence Virtuoso operation using Unix workstations

Preferred Skills and Qualifications

  • Conversant with PCB and Die mechanical layout tools (e.g. Mentor Xpedition, Allegro PCB, Cadence Virtuoso)
  • You are curious and knowledgeable, and willing to pursue proficiency in new technical concepts through self-learning or training opportunities available through company resources
  • Electrical simulation skills
  • Experience using Mentor Fast 3D or Mentor Calibre DRV is a plus

This position is located in Austin, TX

Cirrus Logic is an Equal Opportunity/Affirmative Action Employer. We strive to select the best qualified applicant for any opening and to reward employees based on their skills, experience and performance. We do not discriminate on the basis of race, national origin, pregnancy status, marital status, gender, age, religion, physical or mental disability, medical condition, veteran status, sexual orientation, genetic information or any other characteristic protected by law.